How do you Reball BGA IC?

How do you Reball BGA IC?

1. Step 1: Deball the Device.
2. Step 2: Clean the Deballed Part.
3. Step 3: Apply Paste Flux.
4. Step 4: Put Preform Ball Side Up.
5. Step 5: Carefully Place Device on Top of Preform.
6. Step 6: Square Up Preform to Device.
7. Step 7: Reflow.
8. Step 8: Remove Preform.

What is BGA chip on motherboard?

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package.

What does it mean to Reball a chip?

Reballing involves dismantling, heating the chip until it can be removed from the board, typically with a hot-air gun and vacuum pickup tool, removing the device, removing solder remaining on the device and board, putting new solder balls in place, replacing the original device if there was a poor connection, or using …

How do you use a Reball stencil?

To apply, use a miniature squeegee or brush tool. Hold the tool at a 45-degree angle to the stencil and use just enough force to ensure that the solder paste sticks to the chip through the holes in the stencil. Using your BGA stencil rework station, apply hot air to solidify the solder paste.

How do BGA chips rework?

What are the steps of BGA repair?

1. First, remove the components, such as the PCB.
2. Next, remove the residual solder.
3. Once you have removed all the excess solder, the BGA can be reballed.
4. After the excess solder has been removed and the BGA has been reballed, the components and PCB can be re-soldered and reattached.

How do you clean a BGA chip?

“We currently clean reballed BGA components using an ultrasonic cleaner with hot water and a cleaning solution. The components are then baked at 100 to 120 degrees C to remove any moisture. The components appear very clean after this process.